lead free reflow oven

Totally meet various requirements for lead free processing.

Windows XP operations system and the Chinese /English interface can be switched online freely.

PCL+Modular control design to achieve the high reliable and repetitive accuracy.

Dual temperature sensor and dual safety control model to ensure the system shall cut off when the abnormal occurred.

Adopts the design of independent temperature and the adjustable wind speed to meet a variety of precision from the lead-free soldering process requirements.

The new oven design can effectively reduce the temperature difference between the different size of the electronics element to ensure the reliability of solder joints and eliminate the hidden trouble of thermal damage to components.

The forced cooling system is easily to realize the cooling speed requirements of all kinds of lead-free solder paste(≧3oc/s).

Fault self-diagnosis functions to display the trouble and store it in alarming list.

The control program can produce and backup the different data reports for ISO9000 management.

HS Model can be equipped with KIC24/7 reflow process inspection system.

Standard model features UPS power system to achieve the power-off protection.

Features Over-temperature protection function

The rail is dealt with a special hardening process to make it more stable and reliable.

Automatic lubrication and manually lubricating are available.

The lubricating oil Indirect fill up the chain to reduce the formation of the carbon particles;

The main electric-control equipment and the key components imported from abroad to ensure durability.