PCBA for BGA/SMT/DIP Assembly with 0.6mm/0.024 to 3.2mm/0.126-inch Board Thickness

PCBA for BGA/SMT/DIP Assembly with 0.6mm/0.024 to 3.2mm/0.126-inch Board Thickness

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Basic Info

Payment Type:	T/T or L/C at Sight

Product Description

Features:

PCB assembly and turnkey OEM ODM, contract manufacturing service

Circuit boards: 1 to 22 layers PCB layout, fabrication and PCB assembly and box build

Active and passive components source is directly from original manufacturer and direct agent by our overseas procurement office: Tokyo, Singapore, and Hong Kong

High-precision 0201 size components SMT technology and lead-free RoHS technology SMT process with X-ray ICT AOI and more E-test

Vertically integrated plastic enclosure (case) injection molding, high-volume metal stamping and custom fabrication

Building products experience range: industrial, automotive, computing and storage

Consumer, instrumentation, medical, networking, peripherals and telecommunications

Stable quality can be approved by our good burn-in simulation lab

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