Topscom Precision Industry Co Limited
Topscom Precision Industry Co Limited
Components Purchasing
  • Components Purchasing
  • Components Purchasing
Components Purchasing
Components Purchasing

Components Purchasing

Payment Type:
T/T or L/C at Sight
Quantity:

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Basic Info
Basic Info
Payment Type: T/T or L/C at Sight
Product Description
Product Description
  • Description:
    • Customized print, specifications and/or samples are welcome
    • Materials: ABS, PP, POM, PVC, TPR, TPU, PA and glass fiber or any specific materials upon customers' request
    • Product requirement like dual-injection, high-temperature-endurance, high-hardness and others are available upon request
    • Flexible surface finishing such as chrome plating, painting, water transfer printing, texture, and more are available
    • Inspection report and material test certificates are available upon request
  • Specifications:
    • Plastic molding and injection
    • Sheet metal stamping and punching and stamping dies
    • Painting lines
    • Die-casting lines
    • Powder coating lines
    • Silkscreen and pad printing
    • High-speed SMT and DIP assembly
    • OEM/ODM-based electronics products from PCB to enclosure assembly and function
  • From PCB assembly to final case assembly:
    • Chip-on-board (COB)
    • Surface-mount technology (SMT)
    • Ball-grid array (BGA)
    • Through-hole
  • Customized print, specifications and/or samples are welcome
  • Materials: ABS, PP, POM, PVC, TPR, TPU, PA and glass fiber or any specific materials upon customers' request
  • Product requirement like dual-injection, high-temperature-endurance, high-hardness and others are available upon request
  • Flexible surface finishing such as chrome plating, painting, water transfer printing, texture, and more are available
  • Inspection report and material test certificates are available upon request
  • Plastic molding and injection
  • Sheet metal stamping and punching and stamping dies
  • Painting lines
  • Die-casting lines
  • Powder coating lines
  • Silkscreen and pad printing
  • High-speed SMT and DIP assembly
  • OEM/ODM-based electronics products from PCB to enclosure assembly and function
  • Chip-on-board (COB)
  • Surface-mount technology (SMT)
  • Ball-grid array (BGA)
  • Through-hole
  • Send your message to this supplier

    • Mr.  Frank of OEM I Factory

    • Enter between 20 to 4,000 characters.

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