
Turnkey OEM ODM Contract Manufacturer, Silkscreen and Pad Printing
- Payment Type:
- TT or L/C at Sight
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Basic Info
Payment Type: | TT or L/C at Sight |
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Product Description
Product Description
- Chip-on-board (COB)
- Surface-mount technology (SMT)
- Ball-grid array (BGA)
- Through-hole
- Profound knowledge of contract manufacturing services
- Capable of developing effective production process to ensure high-quality and consistency
- Experienced logistics management
- Cost-effective factory located in mainland China
- Able to handle small as well as large volume production with flexibility
- We also had launched six-sigma DMAIC program since January 2002
- Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medicals, networking, peripherals and telecommunications
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