CHB Electronics Company Limited
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Products
CHB Electronics Company Limited
1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU
  • 1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU
  • 1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU
1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU
1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU

1.0uH, 20%/2.5*2.0/(H)1.2mm Size, DC to DC Converters for CPU

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Description:
    • Halogen-free
    • 125°C maximum total temperature operation
    • 2.7 x 2.2 x 1.2mm maximum surface mount package
    • Powder iron core material
    • Magnetically shielded, low EMI
    • High current carrying capacity and low core losses
    • Inductance range: from 0.33 to 2.2μH
    • Current range: from 1.8 to 7.2Amps
    • Frequency range: up to 5MHz
    • Compliant with RoHS Directive
  • Applications:
    • Voltage regulator module (VRM)
    • Multi-phase regulators
    • Point-of-load modules
    • Smart phone POL modules
    • SSD modules
    • Notebook regulators
    • Battery power systems
    • Graphics cards
    • Data networking and storage systems
  • Environmental data:
    • Storage temperature range: -55 to 125°C
    • Operating temperature range: -55 to +125°C (ambient plus self-temperature rise)
    • Solder reflow temperature: J-STD-020D compliant 
  • Packing:
    • Supplied in tape and reel packing, 3000 parts per 7” diameter reel
  • Remarks:
    • Open circuit inductance (OCL) test parameters: 1MHz, 0.25Vrms, 0.0A DC at +25°C
    • Full load inductance (FLL) test parameters: 1MHz, 0.25Vrms, Isat at +25°C
    • Irms: DC current for an approximate temperature rise of 40°C without core loss
    • Derating is necessary for AC currents
    • PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise
    • It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application
    • Isat: peak current for approximately 30% roll off at +25°C
  • Halogen-free
  • 125°C maximum total temperature operation
  • 2.7 x 2.2 x 1.2mm maximum surface mount package
  • Powder iron core material
  • Magnetically shielded, low EMI
  • High current carrying capacity and low core losses
  • Inductance range: from 0.33 to 2.2μH
  • Current range: from 1.8 to 7.2Amps
  • Frequency range: up to 5MHz
  • Compliant with RoHS Directive
  • Voltage regulator module (VRM)
  • Multi-phase regulators
  • Point-of-load modules
  • Smart phone POL modules
  • SSD modules
  • Notebook regulators
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems
  • Storage temperature range: -55 to 125°C
  • Operating temperature range: -55 to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant 
  • Supplied in tape and reel packing, 3000 parts per 7” diameter reel
  • Open circuit inductance (OCL) test parameters: 1MHz, 0.25Vrms, 0.0A DC at +25°C
  • Full load inductance (FLL) test parameters: 1MHz, 0.25Vrms, Isat at +25°C
  • Irms: DC current for an approximate temperature rise of 40°C without core loss
  • Derating is necessary for AC currents
  • PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise
  • It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application
  • Isat: peak current for approximately 30% roll off at +25°C

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