Six-sided PCBs with FR4 Material

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Basic Info

Payment Type:	T/T

Product Description

Specifications:

Layer: 6 layers
FR-4 material PCB
Surface finish: HASL
With RoHS/UL/ISO9001 logo
Copper thickness: 1oz copper
Board thickness: 1.6mm
Blue mask PCB

Our product range: we offer wide range of PCBs such as single-sided, double-sided, multilayer, high frequency, MCPCB, metal-backed PCB and more

Product quality: our factories got ISO9001, UL certificates and our products meet RoHS standards

Other specifications:

Material: FR-4/Hi Tg FR-4/lead-free (RoHS-compliant)/CEM-1,aluminum, metal-based
Layers: 1 to 28
Finished board thickness: 0.2-3.8mm (8-150mil)
Board thickness tolerance: ±10%
Copper thickness: 0.5-6oz (18-210um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp/twist: 0.70%
Peelable: 0.012 inch (0.3mm)-0.02 (0.5mm)
Images:
- Minimum trace width (a): 0.075mm (3mil)
- Minimum space width (b): 0.1mm (4 mil)
- Minimum annular ring: 0.1mm (4 mil)
- SMD pitch (a): 0.2 mm (8 mil)
- BGA pitch (b): 0.2 mm (8 mil), 0.05mm
Soldermask:
- Minimum soldermask dam (a): 0.0635mm (2.5mil)
- Soldermask clearance (b): 0.1mm (4 mil)
- Minimum SMT pad spacing (c): 0.1mm (4 mil)
- Soldermask thickness: 0.0007 inch (0.018mm)
Holes:
- Minimum hole size (CNC): 0.2mm (8 mil)
- Minimum punch hole size: 0.9mm (35 mil)
Hole size tolerance:
- PTH: ±0.075mm
- NPTH: ±0.05mm
Hole position tolerance: ±0.075mm
Plating:
- HASL: 2.5um
- Lead-free HASL: 2.5um
- Immersion gold:
  - Nickel: 3-7um
  - Au: 1-5um
- OSP: 0.2-0.5um
Outline:
- Panel outline tolerance:
  - CNC: ±0.125mm
  - Punching: ±0.15mm
Beveling: 30 and 45°
Gold finger angle: 15, 30, 45 and 60°
Certificates: RoHS, ISO9001, SGS and UL

Layer: 6 layers

FR-4 material PCB

Surface finish: HASL

With RoHS/UL/ISO9001 logo

Copper thickness: 1oz copper

Board thickness: 1.6mm

Blue mask PCB

Material: FR-4/Hi Tg FR-4/lead-free (RoHS-compliant)/CEM-1,aluminum, metal-based

Layers: 1 to 28

Finished board thickness: 0.2-3.8mm (8-150mil)

Board thickness tolerance: ±10%

Copper thickness: 0.5-6oz (18-210um)

Copper plating hole: 18-40um

Impedance control: ±10%

Warp/twist: 0.70%

Peelable: 0.012 inch (0.3mm)-0.02 (0.5mm)

Images:

Minimum trace width (a): 0.075mm (3mil)
Minimum space width (b): 0.1mm (4 mil)
Minimum annular ring: 0.1mm (4 mil)
SMD pitch (a): 0.2 mm (8 mil)
BGA pitch (b): 0.2 mm (8 mil), 0.05mm

Soldermask:

Minimum soldermask dam (a): 0.0635mm (2.5mil)
Soldermask clearance (b): 0.1mm (4 mil)
Minimum SMT pad spacing (c): 0.1mm (4 mil)
Soldermask thickness: 0.0007 inch (0.018mm)

Holes:

Minimum hole size (CNC): 0.2mm (8 mil)
Minimum punch hole size: 0.9mm (35 mil)

Hole size tolerance:

PTH: ±0.075mm
NPTH: ±0.05mm

Hole position tolerance: ±0.075mm

Plating:

HASL: 2.5um
Lead-free HASL: 2.5um
Immersion gold:
- Nickel: 3-7um
- Au: 1-5um
OSP: 0.2-0.5um

Outline:

Panel outline tolerance:
- CNC: ±0.125mm
- Punching: ±0.15mm

Beveling: 30 and 45°

Gold finger angle: 15, 30, 45 and 60°

Certificates: RoHS, ISO9001, SGS and UL

Minimum trace width (a): 0.075mm (3mil)

Minimum space width (b): 0.1mm (4 mil)

Minimum annular ring: 0.1mm (4 mil)

SMD pitch (a): 0.2 mm (8 mil)

BGA pitch (b): 0.2 mm (8 mil), 0.05mm

Minimum soldermask dam (a): 0.0635mm (2.5mil)

Soldermask clearance (b): 0.1mm (4 mil)

Minimum SMT pad spacing (c): 0.1mm (4 mil)

Soldermask thickness: 0.0007 inch (0.018mm)

Minimum hole size (CNC): 0.2mm (8 mil)

Minimum punch hole size: 0.9mm (35 mil)

PTH: ±0.075mm

NPTH: ±0.05mm

HASL: 2.5um

Lead-free HASL: 2.5um

Immersion gold:

Nickel: 3-7um
Au: 1-5um

OSP: 0.2-0.5um

Nickel: 3-7um

Au: 1-5um

Panel outline tolerance:

CNC: ±0.125mm
Punching: ±0.15mm

CNC: ±0.125mm

Punching: ±0.15mm

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