Hongda Technology (HK) Co. Limited
Hongda Technology (HK) Co. Limited
Telecom 8-layer PCB Assembly with ENIG and Gold Finger
  • Telecom 8-layer PCB Assembly with ENIG and Gold Finger
Telecom 8-layer PCB Assembly with ENIG and Gold Finger

Telecom 8-layer PCB Assembly with ENIG and Gold Finger

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Layer: 8
  • Board size: 337 x 132.15 x 1.57mm
  • Material: FR-4
  • Copper thickness: 1oz
  • Soldermask: black
  • Silkscreen: white
  • Surface finish: ENIG (1u), gold finger
  • Thickness: 10u-14u
  • Nickel thickness: 120u
  • OEM/ODM services are provided
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