Hongda Technology (HK) Co. Limited
Hongda Technology (HK) Co. Limited
OEM Electronic PCB Assembly
  • OEM Electronic PCB Assembly
OEM Electronic PCB Assembly

OEM Electronic PCB Assembly

Payment Type:
T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Specifications:
    • Efficient quotation, strict production, reliable quality
    • Approval: UL, ISO9001
    • Fast delivery
  • OEM/ODM/EMS services for PCBA:
    • PCBA, PCB board assembly: SMT, PTH and BGA
    • PCBA and enclosure design
    • Components sourcing and purchasing
    • Quick prototyping
    • Plastic injection molding
    • Metal sheet stamping
    • Final assembly
    • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
    • Custom clearance for material importing and product exporting
  • Capability-SMT:
    • Lines: 9 (5 Yamaha, 4KME)
    • Capacity: 52 million placements per month
    • Maximum board size: 457*356mm (18x14")
    • Minimum component size: 0201-54sq mm(0.084 sq inch), long connector, CSP, BGA, QFP
    • Speed: 0.15sec/chip, 0.7sec/QFP
  • Capability-PTH:
    • Lines: 2
    • Maximum board width: 400mm
    • Type: dual wave
    • PBS status: lead-free line support
    • Maximum temperature: 399°C
    • Spray flux: add-on
    • Pre-heat: 3
  • AOI testing:
    • Checks for solder paste
    • Checks for components down to 0201"
    • Checks for missing components, offset, incorrect parts, polarity
  • X-ray inspection:
    • X-ray provides high-resolution inspection of:
      • BGAs
      • Micro BGAs
      • Chip scale packages
      • Bare boards
  • In-circuit testing:
    • Commonly used in conjunction with AOI minimizing functional defects caused by component problems
    • Power-up test
    • Advanced function test
    • Flash device programming
    • Functional testing
  • Efficient quotation, strict production, reliable quality
  • Approval: UL, ISO9001
  • Fast delivery
  • PCBA, PCB board assembly: SMT, PTH and BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
  • Custom clearance for material importing and product exporting
  • Lines: 9 (5 Yamaha, 4KME)
  • Capacity: 52 million placements per month
  • Maximum board size: 457*356mm (18x14")
  • Minimum component size: 0201-54sq mm(0.084 sq inch), long connector, CSP, BGA, QFP
  • Speed: 0.15sec/chip, 0.7sec/QFP
  • Lines: 2
  • Maximum board width: 400mm
  • Type: dual wave
  • PBS status: lead-free line support
  • Maximum temperature: 399°C
  • Spray flux: add-on
  • Pre-heat: 3
  • Checks for solder paste
  • Checks for components down to 0201"
  • Checks for missing components, offset, incorrect parts, polarity
  • X-ray provides high-resolution inspection of:
    • BGAs
    • Micro BGAs
    • Chip scale packages
    • Bare boards
  • BGAs
  • Micro BGAs
  • Chip scale packages
  • Bare boards
  • Commonly used in conjunction with AOI minimizing functional defects caused by component problems
  • Power-up test
  • Advanced function test
  • Flash device programming
  • Functional testing
  • Send your message to this supplier

    • Enter between 20 to 4,000 characters.

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