Double-sided PCBs, Hot Selling Lead-free, HASL Board with Best Quality

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Basic Info

Payment Type:	T/T

Product Description

Raw materials: FR4, FR5 (high TG), CEM-1 and AI-base

Surface: gold plating, HAL, OSP and gold finger

Warp age:

Single-side: <1.0%
Double-side: <0.6%
Multilayer: <0.6%

Minimum thickness/tolerance: 0.2 and 0.08mm

Minimum line width/space and tolerance:

HAL PCB: 0.10mm + 20% (4mil+20%)
Gold PCB: 0.075mm + 20% (3mil+20%)

Copper to edge-board spacing: 0.5mm (20mil)

Hole side to edge-board spacing: 0.3mm (7.87mil)

Minimum hole size and tolerance: 0.1mm/4mil (laser hole)

Tolerance: +0.075mm/3mil for PTH diameter, +0.05mm/2mil for non-PTH diameter

Minimum hole space and tolerance: 0.4 and 0.076mm (15.75 and + 3mil)

Hole wall thickness: 20 to 25μm (0.79 to 1.0mil)

Hole position deviation: +0.076mm (+3mil)

Minimum round hole diameter (for punch): 1.0mm (40mil), with PCB thickness

1.5mm (59mil) with PCB thickness FR4 1.2 to 3.0mm (47 to 120mil)

Minimum square figure hole diameter (for punch): 0.8 x 0.8mm (31.5 x 31.5mil) with PCB thickness < FR-4 and CEM-3 1.0mm, 1.0 x 1.0mm (40 x 40mil) with PCB thickness FR-4 and CEM-3 1.2-3.00mm (47 to 120mil)

Finished board size tolerance:

CNC: +0.1mm (+4mil)
Punch: +0.15mm (+6mil)

V-cut position tolerance: +0.2mm (+8mil)

Base material thickness: 0.2 to 3.5mm

Base material copper thickness: 18, 35 and 70μm

Electrolytic flash gold with thickness of 0.4 to 3.0 micro inches:

Au: 0.01 to 0.076 micron
Ni: 5 to 15mm

Selective immersion gold with thickness of 1 to 4 micro inches:

Au: 0.025 to 0.1 micron
Ni: 2.54 to 5.5mm

Gold tab/finger plating with thickness of 5 to 30 micro inches:

Au: 0.125 to 0.76 micron

Electroless immersion tin with thickness of 20 to 48 micro inches: 05 to 1.2 microns

Single-side: <1.0%

Double-side: <0.6%

Multilayer: <0.6%

HAL PCB: 0.10mm + 20% (4mil+20%)

Gold PCB: 0.075mm + 20% (3mil+20%)

CNC: +0.1mm (+4mil)

Punch: +0.15mm (+6mil)

Au: 0.01 to 0.076 micron

Ni: 5 to 15mm

Au: 0.025 to 0.1 micron

Ni: 2.54 to 5.5mm

Au: 0.125 to 0.76 micron

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