Shielded SMD Power Inductors with LCP Base and Epoxy Resin Adhesive

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Basic Info

Payment Type:	T/T, L/C

Product Description

Inductance range: 3.3 to 22μ

HSMD taping and reel packing

Suitable for automatic SMD equipment assembly

Materials:

Storage temperature range: -40 to 125°C

Operating temperature range: -25 to 105°C

Rated current:

Ordering information example:

Packing: bulk, 600 pieces/reel

Core: MPP toroidal core

Wire: enameled copper wire

Base: LCP

Housing: PBT-4130, UL94V-0

Terminal: tinned copper flat

Adhesive: epoxy resin

I1 delta L/L0A: 10% typical

I2 delta L/L0A: 20% typical

Irms: temperature/rise of 30°C (maximum)

Resistance to solder heat: 260°C, 10s

DWG number: ST3008 (A or B)

Inductance: 82μH ±10%

Test frequency: 1kHz

RDC maximum: 0.440MΨI1

(A) typical delta L/L0A (10%): 0.54I2

(A) typical delta L/L0A (20%): 0.75Irms

(A) delta T: 30°C 0.75 (maximum)

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