Shenzhen Shenyixin Electronic Limited
Shenzhen Shenyixin Electronic Limited
Hot Air Leveling Double-sided PCB Board
  • Hot Air Leveling Double-sided PCB Board
Hot Air Leveling Double-sided PCB Board

Hot Air Leveling Double-sided PCB Board

Payment Type:
Telegraphic Transfer (TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Specifications:
    • Base material: FR4
    • Board thickness: 1.0mm
    • Layers: 2
    • Minimum line width/spacing: 0.2/0.3mm
    • Minimum hole diameter: 0.4mm
    • Finishing copper thickness: 1oz
  • Applications:
    • Craftability table:
      • Minimum line width/spacing: 0.075/0.075mm
      • Minimum solder mask dam: 0.075mm
      • Minimum and maximum board thickness: 0.1-3.2mm
      • Maximum finishing copper thickness: 10oz
      • Maximum board size: 546 x 1,200mm
      • Maximum layers count: 22
      • Impedance control: ±8%
  • Base material: FR4
  • Board thickness: 1.0mm
  • Layers: 2
  • Minimum line width/spacing: 0.2/0.3mm
  • Minimum hole diameter: 0.4mm
  • Finishing copper thickness: 1oz
  • Craftability table:
    • Minimum line width/spacing: 0.075/0.075mm
    • Minimum solder mask dam: 0.075mm
    • Minimum and maximum board thickness: 0.1-3.2mm
    • Maximum finishing copper thickness: 10oz
    • Maximum board size: 546 x 1,200mm
    • Maximum layers count: 22
    • Impedance control: ±8%
  • Minimum line width/spacing: 0.075/0.075mm
  • Minimum solder mask dam: 0.075mm
  • Minimum and maximum board thickness: 0.1-3.2mm
  • Maximum finishing copper thickness: 10oz
  • Maximum board size: 546 x 1,200mm
  • Maximum layers count: 22
  • Impedance control: ±8%
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