
Hot Air Leveling Double-sided PCB Board
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- Telegraphic Transfer (TT, T/T)
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Basic Info
Payment Type: | Telegraphic Transfer (TT,T/T) |
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Product Description
Product Description
- Base material: FR4
- Board thickness: 1.0mm
- Layers: 2
- Minimum line width/spacing: 0.2/0.3mm
- Minimum hole diameter: 0.4mm
- Finishing copper thickness: 1oz
- Craftability table:
- Minimum line width/spacing: 0.075/0.075mm
- Minimum solder mask dam: 0.075mm
- Minimum and maximum board thickness: 0.1-3.2mm
- Maximum finishing copper thickness: 10oz
- Maximum board size: 546 x 1,200mm
- Maximum layers count: 22
- Impedance control: ±8%
- Minimum line width/spacing: 0.075/0.075mm
- Minimum solder mask dam: 0.075mm
- Minimum and maximum board thickness: 0.1-3.2mm
- Maximum finishing copper thickness: 10oz
- Maximum board size: 546 x 1,200mm
- Maximum layers count: 22
- Impedance control: ±8%
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