TSPC-FR370F Plastic Resin Film, Flame Retardant, 0.250mm Thickness

TSPC-FR370F Plastic Resin Film, Flame Retardant, 0.250mm Thickness

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Basic Info

Payment Type:	Letter of Credit (LC, L/C)

Product Description

Specifications:

Thickness: 0.175-1.00mm
Texture: fine matted/velvet
Color: black

Characteristic:

Teesunny PC-FR370F meets the EU, RoHS Directive and the UL94 V0class safety standards
It is a transparent film, characterized by low-hygroscopicity,favorable withstand voltage and heat resistance,perforation/tearing stability, having good bonding properties withmetal
Meets the most rigorous environmental requirements of theglobal well-known enterprises
Free halogen, free heavy metal, free phosphate,environment-friendly
Can be processed by die cutting, embossing and cold pressing,also can be printed by hot stamping, offset printing and anilineprinting, plate printing as well as concave/letterpress printingwithout special ink

Applications:

Electronic components, electrical shell, switch panels,junction box and charger shell, automobile instrument panels andany printing panels with flame retardant requirement
Keyword: low-hygroscopicity and heat resistance

Thickness: 0.175-1.00mm

Texture: fine matted/velvet

Color: black

Teesunny PC-FR370F meets the EU, RoHS Directive and the UL94 V0class safety standards

It is a transparent film, characterized by low-hygroscopicity,favorable withstand voltage and heat resistance,perforation/tearing stability, having good bonding properties withmetal

Meets the most rigorous environmental requirements of theglobal well-known enterprises

Free halogen, free heavy metal, free phosphate,environment-friendly

Can be processed by die cutting, embossing and cold pressing,also can be printed by hot stamping, offset printing and anilineprinting, plate printing as well as concave/letterpress printingwithout special ink

Electronic components, electrical shell, switch panels,junction box and charger shell, automobile instrument panels andany printing panels with flame retardant requirement

Keyword: low-hygroscopicity and heat resistance

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