IMD/IML Guide Hole Punching Machine, 0.4 to 0.8MPa PressureNew

IMD/IML Guide Hole Punching Machine, 0.4 to 0.8MPa PressureNew

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Punching and drilling hole for below materials:

Mobile phone panel, FPC IML/IMD, flexible PCB, single-sided PCB, inner-layer PCB, multilayer PCB, PVC/PET/PC panel, thin film switch, membrane panel, nameplates, film, conductive film, aluminum plate and other thin metal panels

Specifications:

Precision: ±0.015mm (VT015, VTZ15), ±0.008mm (VT008, VTZ08)
Speed: 0.5 second/hole
Maximum momentum: 2000N (VT015, VT008), 6000N (VT015, VT008)
Thicknesses: 0.01 to 3mm (depend on material)
Punching diameters: Φ1 to 5mm (OEM)
Pressure requirements: 0.4 to 0.8MPa
Power requirements: 220V AC ±15V, 50Hz
Light source: infrared transmission, reflection infrared
Weight: 198 ±2kg
Dimensions: 1250 x 770 x 770 + 260mm

Features:

Applies to various thicknesses of PCB, FPC IML/IMD, PVC/PET/PC panel, thin film switch and membrane panel
Results are neither burrs nor enlargement surrounding processed holes
Interactive-communication operational system with mouse operating tool (Windows XP operating system) enables procedure of process to become easier, faster and efficient
Large and wide operational stage enables object to be moved and rotated easily
High speed: super high punching speed enables process of hole-recognizing and target-punching to be within one second
Precise-transmission and micro-step motor driver used to enhance accuracy and stability
Up light or down light enables every materials of targeting holes to be identified easily and to enhance accuracy of recognition in targeting shape
No foot paddle needed, all operating be finished by touch-screen
Sensitive enough to enhance speed of operating
Users can choose various tooling sizes to punch various diameter and thickness material
Sampling plans can be saved and then can be used directly next time

Mobile phone panel, FPC IML/IMD, flexible PCB, single-sided PCB, inner-layer PCB, multilayer PCB, PVC/PET/PC panel, thin film switch, membrane panel, nameplates, film, conductive film, aluminum plate and other thin metal panels

Precision: ±0.015mm (VT015, VTZ15), ±0.008mm (VT008, VTZ08)

Speed: 0.5 second/hole

Maximum momentum: 2000N (VT015, VT008), 6000N (VT015, VT008)

Thicknesses: 0.01 to 3mm (depend on material)

Punching diameters: Φ1 to 5mm (OEM)

Pressure requirements: 0.4 to 0.8MPa

Power requirements: 220V AC ±15V, 50Hz

Light source: infrared transmission, reflection infrared

Weight: 198 ±2kg

Dimensions: 1250 x 770 x 770 + 260mm

Applies to various thicknesses of PCB, FPC IML/IMD, PVC/PET/PC panel, thin film switch and membrane panel

Results are neither burrs nor enlargement surrounding processed holes

Interactive-communication operational system with mouse operating tool (Windows XP operating system) enables procedure of process to become easier, faster and efficient

Large and wide operational stage enables object to be moved and rotated easily

High speed: super high punching speed enables process of hole-recognizing and target-punching to be within one second

Precise-transmission and micro-step motor driver used to enhance accuracy and stability

Up light or down light enables every materials of targeting holes to be identified easily and to enhance accuracy of recognition in targeting shape

No foot paddle needed, all operating be finished by touch-screen

Sensitive enough to enhance speed of operating

Users can choose various tooling sizes to punch various diameter and thickness material

Sampling plans can be saved and then can be used directly next time

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