DAWN TECHNOLOGIES (HK) LIMITED
DAWN TECHNOLOGIES (HK) LIMITED
8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter
  • 8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter
  • 8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter
8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter
8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter

8 Layers Rigid-flex Board, 0.3mm Minimum Via Diameter

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layers count: 8
  • Finish thickness: 1.6 ± 10%mm
  • Minimum width/spacing: 0.12/.12mm
  • Minimum via diameter: 0.3mm
  • Surface finish: ENIG
  • Specialty: L1-3
  • L6-8: rigid layer
  • L4-5: flexible layer
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