DAWN TECHNOLOGIES (HK) LIMITED
DAWN TECHNOLOGIES (HK) LIMITED
TP FPC Flexible Board
  • TP FPC Flexible Board
  • TP FPC Flexible Board
  • TP FPC Flexible Board
  • TP FPC Flexible Board
TP FPC Flexible Board
TP FPC Flexible Board
TP FPC Flexible Board
TP FPC Flexible Board

TP FPC Flexible Board

Payment Type:
Cash Advance (CA)
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Basic Info
Basic Info
Payment Type: Cash Advance (CA)
Product Description
Product Description
  • Flatbed TP touch panel
  • IC integrated circuit
  • Number of layers: 2 layers (flexible)
  • Base material thickness: 25UM
  • Copper conductor thickness: 18UM
  • Materials: polyester, polyimide, DuPont
  • Copper: RA, ED
  • Minimum hole diameter: 0.15mm
  • Minimum line/space width: 0.075mm
  • Minimum annular ring: 0.1mm
  • Maximum panel size: 400 x 400mm
  • Plating: solder, nickel, gold
  • Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P55617)
  • Solder heat resistance: 300-degree C/10 seconds
  • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
  • Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
  • Peeling strength (180-degree direction): 1.0kg/cm (IPC-TM-650 2.4.9)
  • Flammability: 94 V-0 (UL94)
  • Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P-55617)
  • RoHS compliant, UL
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