Succeedin Summer Corp. Ltd
Succeedin Summer Corp. Ltd
FR-4 Multilayer PCB Board with HASL, Tin/Gold/Silver Plating Surface Finish, Etched Copper Based
  • FR-4 Multilayer PCB Board with HASL, Tin/Gold/Silver Plating Surface Finish, Etched Copper Based
FR-4 Multilayer PCB Board with HASL, Tin/Gold/Silver Plating Surface Finish, Etched Copper Based

FR-4 Multilayer PCB Board with HASL, Tin/Gold/Silver Plating Surface Finish, Etched Copper Based

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Base material: FR-4
  • OEM orders are welcome
  • Copper thickness: H/H OZ
  • Board thickness: 1.6mm
  • Minimum hole size: 0.45mm
  • Minimum line width: 0.20mm
  • Minimum line spacing: 0.15mm
  • Surface finish: plating gold, HSL
  • Colors: green, white, blue, black, gray and so on
  • UL-listed, compliant with RoHS Directive
  • Production capability:
    • Layer:  2-32, multilayer
    • Board thickness: 0.2 (min) to 2.0mm (maximum)
    • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, FR-1, FR-2
    • Maximum finished board size: 1,500 x 500mm
    • Minimum drilled hole size: 0.3mm
    • Minimum line width: 0.13mm
    • Minimum line spacing: 0.1mm
    • Surface finish/treatment: HASL/HASL lead-free, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating
    • Copper thickness: 1/2-3.0oz
    • Solder mask color: green/yellow/black/white/red/blue
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
    • Hole tolerance: (PTH) ±0.076, (NPTH) ±0.05
    • Certificates: UL, SGS, RoHS, CQC, ISO 9001, ISO 14000
    • Provides OEM services to all sorts of printed circuit board assembly
  • Layer:  2-32, multilayer
  • Board thickness: 0.2 (min) to 2.0mm (maximum)
  • Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, FR-1, FR-2
  • Maximum finished board size: 1,500 x 500mm
  • Minimum drilled hole size: 0.3mm
  • Minimum line width: 0.13mm
  • Minimum line spacing: 0.1mm
  • Surface finish/treatment: HASL/HASL lead-free, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating
  • Copper thickness: 1/2-3.0oz
  • Solder mask color: green/yellow/black/white/red/blue
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Hole tolerance: (PTH) ±0.076, (NPTH) ±0.05
  • Certificates: UL, SGS, RoHS, CQC, ISO 9001, ISO 14000
  • Provides OEM services to all sorts of printed circuit board assembly
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