
High-density Multilayer PCB Design with 0.2 to 4.00mm Board Thickness
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- T/T in Advance
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Basic Info
Payment Type: | T/T in Advance |
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Product Description
Product Description
- Re-layouts
- Bare PCB/ FPC fabrication
- Components procurement
- Assemble the boards, SMT/BGA/DIP
- Mechanical testing
- Functional testing
- Inspection of finished products
- Wire harnesses and cable assembly
- Case, housing and rubber molding assemble
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