PCB Assembly with 0.3mm Pitch, Ideal for Mobile Phones

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

12 lines and all of them can make RoHS compliant products

Machines can make BGA, CSP, LLP, and many other special package components

Capacity: 10-million chips/day (two shifts)

10 M/I (wave soldering) lines, three of them are for RoHS products and can be expanded to seven lines

OEM/ODM orders are welcome

M/I components such as axis resistor, capacitor and diode can be performed automatically

PCB SMT:

PCB:

Six convey lines in RoHS solution

All lines can make small products such as MP3/MP4 players and mobile phones

Fully turnkey and prototype services are provided

Machine size: 457 x 356mm (minimum)

Size: 50 x 50mm (minimum)

Size (QFP): 45 x 45mm (minimum)

Pitch: 0.3mm

Size: 550 x 350mm (maximum)

Size: 50 x 35mm (minimum)

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