Fullwill Technology Co. Ltd
Fullwill Technology Co. Ltd
PCB Assembly with 3mm Pitch, Provides BGA, CSP and LLP Components, OEM/ODM Orders Accepted
  • PCB Assembly with 3mm Pitch, Provides BGA, CSP and LLP Components, OEM/ODM Orders Accepted
PCB Assembly with 3mm Pitch, Provides BGA, CSP and LLP Components, OEM/ODM Orders Accepted

PCB Assembly with 3mm Pitch, Provides BGA, CSP and LLP Components, OEM/ODM Orders Accepted

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • 12 lines and all of them can make RoHS products
  • Size of PCB (with SMT machine):
    • Maximum size: 457 x 356mm
    • Minimum size: 50 x 50mm
  • Minimum size of QFP: 45 x 45mm
  • Pitch: 0.3mm
  • Minimum size of chip: 201mm
  • Can make BGA, CSP, LLP and other many special package components
  • Total capacity: 10 million chips/day (two shifts)M/I components (such as axis resistor, capacitor and diode) can be preformed automatically
  • Maximum size of PCB they can make is: 550 x 350mm
  • Minimum size: 50 x 35mm
  • Six convey lines in RoHS solution
  • All lines can make small products such as MP3, MP4 players and mobile phones
  • Maximum size: 457 x 356mm
  • Minimum size: 50 x 50mm
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