PCB Assembly with 0.3mm Pitch, Prototyping, and Six Convey Lines in RoHS Solution

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

With 12 lines

Pitch: 0.3mm

With prototyping

Size of chip: 0201 (minimum)

Machines can also make BGA, CSP, LLP, and other special package components

Total capacity: 10 million chips per day (two shifts)

There are 10 M/I (wave soldering) lines and three of them can be expanded to seven lines

M/I components (such as axis resistor, capacitor, and diode) can be preformed automatically

With six convey lines in RoHS solution

Any lines can make small products such as MP3/MP4 players and mobile phones

Provided turnkey and prototype service:

RoHS-compliant

Size of PCB SMT machine (L x W): 457 x 356mm (maximum)

Size (L x W): 50 x 50mm (minimum)

Size of QFP: 45 x 45mm (minimum)

Size of PCB (L x W): 550 x 350mm (maximum)

Size of PCB (L x W): 50 x 35mm (minimum)

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