Fullwill Technology Co. Ltd
Fullwill Technology Co. Ltd
PCB Assembly with 0.3mm Pitch, Sized 50 x 50mm, in RoHS Solution
  • PCB Assembly with 0.3mm Pitch, Sized 50 x 50mm, in RoHS Solution
PCB Assembly with 0.3mm Pitch, Sized 50 x 50mm, in RoHS Solution

PCB Assembly with 0.3mm Pitch, Sized 50 x 50mm, in RoHS Solution

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • 12 lines and all of them can make RoHS products
  • Machines can make BGA, CSP, LLP, and other many special package components
  • Capacity: 10-million chips/day (two shifts)10 M/I (wave soldering) lines, three of them are for RoHS products and can be expanded to seven lines
  • M/I components such as axis resistor, capacitor, and diode can be performed automatically
  • PCB SMT machine size: 457 x 356mm (maximum)
  • PCB size: 50 x 50mm/45 x 45mm/50 x 35mm (minimum)
  • Pitch: 0.3mm
  • PCB size: 550 x 350mm (maximum)
  • Six convey lines in RoHS solution
  • All lines can make small products such as MP3/MP4 players and mobile phones
  • Fully turn-key and prototype services are provided
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