Fullwill Technology Co. Ltd
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Products
Fullwill Technology Co. Ltd
PCB Assembly with 0.3mm Pitch and 12 Convey Lines
  • PCB Assembly with 0.3mm Pitch and 12 Convey Lines
  • PCB Assembly with 0.3mm Pitch and 12 Convey Lines
PCB Assembly with 0.3mm Pitch and 12 Convey Lines
PCB Assembly with 0.3mm Pitch and 12 Convey Lines

PCB Assembly with 0.3mm Pitch and 12 Convey Lines

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • With 12 convey lines
  • Pitch: 0.3mm
  • Size of chip: 0201
  • Machines can also make BGA, CSP, LLP and other special package components
  • Total capacity: 10 million chips per day (two shifts)
  • There are 10 M/I (wave soldering) lines and three of them can be expanded to seven lines
  • M/I components (such as axis resistor, capacitor and diode) can be preformed automatically
  • With six convey lines in RoHS solution
  • All lines can make small products such as MP3/MP4 players and mobile phones
  • Provides turnkey and prototype service
  • Size of PCB SMT machine (L x W): 457 x 356mm
  • Size (L x W): 50 x 50mm
  • Size of QFP: 45 x 45mm
  • Size of PCB (L x W): 550 x 350mm
  • Size of PCB (L x W): 50 x 35mm
  • Compliant with the RoHS Directive

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