Fullwill Technology Co. Ltd
Fullwill Technology Co. Ltd
PCB Assembly with BGA, CSP, LLP, 0,201 Chips and 0.3mm Pitch, Measures 50 x 50 or 45 x 45mm
  • PCB Assembly with BGA, CSP, LLP, 0,201 Chips and 0.3mm Pitch, Measures 50 x 50 or 45 x 45mm
PCB Assembly with BGA, CSP, LLP, 0,201 Chips and 0.3mm Pitch, Measures 50 x 50 or 45 x 45mm

PCB Assembly with BGA, CSP, LLP, 0,201 Chips and 0.3mm Pitch, Measures 50 x 50 or 45 x 45mm

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • 12 lines and all of them can make RoHS products
  • Machines can make BGA, CSP, LLP and other many special package components
  • Capacity: 10-million chip/day (two shifts)10 M/I (wave soldering) lines, three of them are for RoHS products and can be expanded to seven lines
  • M/I components such as axis resistor, capacitor and diode can be performed automatically
  • PCB SMT machine maximum size: 457 x 356mm
  • Minimum size: 50 x 50 or 45 x 45mm
  • Pitch: 0.3mmPCB maximum size: 550 x 350mm
  • Minimum size: 50 x 35mm
  • With RoHS Directive-compliant
  • For MP3/MP4 player and mobile phones
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