
PCB Assembly with BGA, CSP, LLP, 0201 Chips and 0.3mm Pitch, Measuring 50 x 50 or 45 x 45mm
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- Telegraphic Transfer in Advance (Advance TT, T/T)
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Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- 12 lines and all of them can make RoHS Directive-compliant products
- Machines can make BGA, CSP, LLP and other many special package components
- Capacity: 10 million chips/day (two shifts)10 M/I (wave soldering) lines, three of them are for RoHS products and can be expanded to seven lines
- M/I components such as axis resistor, capacitor and diode can be performed automatically
- Pitch: 0.3mm
- Maximum size: 457 x 356mm
- Minimum size: 50 x 50 or 45 x 45mm
- RoHS directive-compliant
- Maximum size: 550 x 350mm
- Minimum size: 50 x 35mm
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