PCB Assembly with 0.3mm Pitch, Provides Turnkey and Prototype Services

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Features:

Pitch: 0.3mm
Minimum size of chip: 0201
Machines can also make BGA, CSP, LLP and other many specialpackage components
Total capacity: 10 million chips/day (two shifts)
There are 10 M/I (wave soldering) lines, three of them are forRoHS products and can be expanded to seven lines
M/I components (such as axis resistor, capacitor and diode) canbe preformed automatically
Available with six convey lines in RoHS solution
All lines can make small products such as MP3/MP4 players andmobile phones
Provide turnkey and prototype service
Maximum size of PCB our SMT machine (L x W): 457 x 356mm
Minimum size: 50 x 50mm
Minimum size of QFP: 45 x 45mm
Maximum size of PCB: 550 x 350mm
Minimum size of PCB: 50 x 35mm