Fullwill Technology Co. Ltd
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Fullwill Technology Co. Ltd
PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm
  • PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm
  • PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm
PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm
PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm

PCB Assembly with 0.3mm Pitch and 12 Convey Lines, Size of QFP 45 x 45mm

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • With 12 convey lines
  • Pitch: 0.3mm
  • Size of chip: 0201
  • Machines can also make BGA, CSP, LLP and other special package components
  • Total capacity: 10 million chips per day (two shifts)
  • There are 10 M/I (wave soldering) lines and three of them can be expanded to seven lines
  • M/I components (such as axis resistor, capacitor and diode) can be preformed automatically
  • With six convey lines in RoHS solution
  • All lines can make small products such as MP3/MP4 players and mobile phones
  • Provides turnkey and prototype service:
    • Size of PCB SMT machine (L x W): 457 x 356mm
    • Size (L x W): 50 x 50mm
    • Size of QFP: 45 x 45mm
    • Size of PCB (L x W): 550 x 350mm
    • Size of PCB (L x W): 50 x 35mm
  • With the RoHS Directive-compliant
  • Size of PCB SMT machine (L x W): 457 x 356mm
  • Size (L x W): 50 x 50mm
  • Size of QFP: 45 x 45mm
  • Size of PCB (L x W): 550 x 350mm
  • Size of PCB (L x W): 50 x 35mm

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