Comcome Limited
Comcome Limited
One-stop OEM, turkey PCB service, Cable and harness Assembly, OEM/ODM, Surface-mount Prototype Assem
  • One-stop OEM, turkey PCB service, Cable and harness Assembly, OEM/ODM, Surface-mount Prototype Assem
One-stop OEM, turkey PCB service, Cable and harness Assembly, OEM/ODM, Surface-mount Prototype Assem

One-stop OEM, turkey PCB service, Cable and harness Assembly, OEM/ODM, Surface-mount Prototype Assem

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TT in advance, L/C at sight or PayPal
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Basic Info
Basic Info
Payment Type: TT in advance, L/C at sight or PayPal
Product Description
Product Description
  • Comcomecorp offer PCB Solutions service, a printed circuit board contract manufacturer that offers surface mount technology (SMT), through-hole assembly, box-build assembly and more.  Below is a list of some of our most popular PCB assembly services:
  • Surface-mount
  • Through-hole technologies
  • Hand finish work
  • Thru hole selective solder capabilities
  • 0201 placement, fine pitch components (0.10" pitch)
  • BGA assembly placement and rework capabilities
  • Prototype assembly
  • Aqueous PCBA cleaning
  • X-Ray verified PCBA and inspection
  • PCBA test Analysis
  • Box built assembly
  • PCBA manufacturing consulting
  • Cable and harness assemblies
  • Complete electrical test and evaluation are available. We also have expertise in packaging, from commercial to consumer level. We provide both labor only and turnkey contracting. We will also work with any combination of parts and labor.
  • We are dedicated to producing quality products and services with on time deliveries at reasonable prices. Our goal is to add value to our customer's products through the overall quality of our services. We also offer engineering service which includes product design, prototypes and small lot to full production support.
  • PCB Process capability
  • Item Parameters
    • Rigid board Flex-(Rigid) board
    • Layers 1-40 layers: 0-10/11-14 layers
    • Max.working panel: 508x610(mm) 457x610 or 254x737(mm)
    • Min. line width/spacing: 3/3 mil for 0.5oz base copper 3/3 mil for 0.5oz base copper
    • Min. hole size: 0.1mm for laser drill 0.20mm
    • Copper thickness: 12-280um 12-105um
    • Finished board thickness: 0.2-8.0mm 0.071-1.8mm
    • Drill to copper: 7mil(min) /
    • Aspect ratio: 20:01 10:01
    • Impedance control: 5% 10%
    • High voltage test: 4000v /
    • Base material: CEM1,CEM3,FR1,FR2,
    • FR4,Halogen free FR4,High TG FR-4,Rogers,Getek, Arlon, Nelco,Rcc,Hy-bird, PTFE,etc. PI
    • Normal surface finish: HASL, Lead Free HASL, HASL, Lead Free HASL,
    • ENIG, Imm.Sn, Imm.Ag, ENIG, Imm.Sn, Imm.Ag,
    • OSP, Flash Gold, Hard Gold plated, Gold Finger OSP, Flash Gold, Hard Gold plated, Gold Finger, Silver Slurry
    • Selective surface: HASL/LF HASL+Gold Finger, HASL/LF HASL+Gold Finger
    • Finish: HASL/LF HASL+ENIG, HASL/LF HASL+ENIG
    • ENIG/IMM.Sn/IMM.Ag+G/F ENIG/IMM.Sn/IMM.Ag+G/F
    • ENIG+OSP ENIG+OSP
    • OSP+G/F Silver Slurry+Gold plated
    • Silver slurry+ENIG
    • Normal: IPC-A-600G class 2 IPC-A-600G class 2
    • Advance: IPC-A-600G class 3 IPC-A-600G class 3
    • Item: rigid board
    • Normal: advance
    • Inner layer registration: ±3mil
    • Min. solder maks dam: 3mil 2.5mil
    • Tolerance of line width/spacing: ±20% ±10%
  • Rigid board Flex-(Rigid) board
  • Layers 1-40 layers: 0-10/11-14 layers
  • Max.working panel: 508x610(mm) 457x610 or 254x737(mm)
  • Min. line width/spacing: 3/3 mil for 0.5oz base copper 3/3 mil for 0.5oz base copper
  • Min. hole size: 0.1mm for laser drill 0.20mm
  • Copper thickness: 12-280um 12-105um
  • Finished board thickness: 0.2-8.0mm 0.071-1.8mm
  • Drill to copper: 7mil(min) /
  • Aspect ratio: 20:01 10:01
  • Impedance control: 5% 10%
  • High voltage test: 4000v /
  • Base material: CEM1,CEM3,FR1,FR2,
  • FR4,Halogen free FR4,High TG FR-4,Rogers,Getek, Arlon, Nelco,Rcc,Hy-bird, PTFE,etc. PI
  • Normal surface finish: HASL, Lead Free HASL, HASL, Lead Free HASL,
  • ENIG, Imm.Sn, Imm.Ag, ENIG, Imm.Sn, Imm.Ag,
  • OSP, Flash Gold, Hard Gold plated, Gold Finger OSP, Flash Gold, Hard Gold plated, Gold Finger, Silver Slurry
  • Selective surface: HASL/LF HASL+Gold Finger, HASL/LF HASL+Gold Finger
  • Finish: HASL/LF HASL+ENIG, HASL/LF HASL+ENIG
  • ENIG/IMM.Sn/IMM.Ag+G/F ENIG/IMM.Sn/IMM.Ag+G/F
  • ENIG+OSP ENIG+OSP
  • OSP+G/F Silver Slurry+Gold plated
  • Silver slurry+ENIG
  • Normal: IPC-A-600G class 2 IPC-A-600G class 2
  • Advance: IPC-A-600G class 3 IPC-A-600G class 3
  • Item: rigid board
  • Normal: advance
  • Inner layer registration: ±3mil
  • Min. solder maks dam: 3mil 2.5mil
  • Tolerance of line width/spacing: ±20% ±10%
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    • Ms.  Cheung Overseas

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