One-stop OEM, turkey PCB service, Cable/ harness Assembly, Surface-mount Prototype Assembly

One-stop OEM, turkey PCB service, Cable/ harness Assembly, Surface-mount Prototype Assembly

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Basic Info

Payment Type:	T/T or L/C at Sight or PayPal

Product Description

Surface-mount

Through-hole technologies

Hand finish work

Thru Hole Selective Solder Capabilities

0201 Placement, Fine Pitch Components (0.10" pitch)

BGA Assembly Placement and Rework Capabilities

Prototype Assembly

Aqueous PCBA Cleaning

X-Ray Verified PCBA and Inspection

PCBA Test Analysis

Box Build Assembly

PCBA Manufacturing Consulting

Cable and harness Assemblies

Complete electrical test and evaluation are available. We also have expertise in packaging, from commercial to consumer level. We provide both labor only and turnkey contracting. We will also work with any combination of parts and labor.

We are dedicated to producing quality products and services with on time deliveries at reasonable prices. Our goal is to add value to our customer's products through the overall quality of our services. We also offer engineering service which includes product design, prototypes and small lot to full production support.

PCB Process capability

Item Parameters

Rigid board Flex-(Rigid) board
Layers 1-40 layers 0-10/11-14 layers
Max.working panel: 508x610(mm) 457x610 or 254x737(mm)
Min. line width/spacing: 3/3 mil for 0.5oz base copper 3/3 mil for 0.5oz base copper
Min. hole size 0.1mm for laser drill: 0.20mm
Copper thickness: 12-280um 12-105um
Finished board thickness: 0.2-8.0mm 0.071-1.8mm
Drill to copper: 7mil(min) /
Aspect ratio: 20:01 10:01
Impedance control: 5% 10%
High voltage test: 4000v /
Base material: CEM1,CEM3,FR1,FR2,
FR4,Halogen free FR4,High TG FR-4,Rogers,Getek, Arlon, Nelco,Rcc,Hy-bird, PTFE,etc. PI
Normal Surface finish HASL, Lead Free HASL, HASL, Lead Free HASL,
ENIG, Imm.Sn, Imm.Ag, ENIG, Imm.Sn, Imm.Ag,
OSP, Flash Gold, Hard Gold plated, Gold Finger OSP, Flash Gold, Hard Gold plated, Gold Finger, Silver Slurry
Selective surface: HASL/LF HASL+Gold Finger, HASL/LF HASL+Gold Finger
finish HASL/LF HASL+ENIG, HASL/LF HASL+ENIG
ENIG/IMM.Sn/IMM.Ag+G/F ENIG/IMM.Sn/IMM.Ag+G/F
ENIG+OSP ENIG+OSP
OSP+G/F Silver Slurry+Gold plated
Silver Slurry+ENIG
Normal IPC-A-600G class 2 IPC-A-600G class 2
Advance IPC-A-600G class 3 IPC-A-600G class 3
Item Rigid board
Normal Advance
Inner layer registration: ±3mil
Min. solder maks dam 3mil: 2.5mil
Tolerance of line width/spacing: ±20% ±10%
Tolerance of FBT: ±10% ±8%
Min. QFP spacing: 20mil 16mil(not HASL)
Tolerance of PTH: ±3mil ±2mil
Tolerance of NPTH: ±2mil ±1mil
Bow twist: 0.75%(max) 0.5%(max)
Hole wall roughness: 1.5mil(max) 1mil(max)
Outline tolerance: ±4mil ±3mil for routing