1 Layer PCB with 2oz Copper, 2.5 Thickness
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Product Description
Product Description
- Material: FR-4/Hi Tg FR-4/lead free, (RoHS compliant)/CEM-3, aluminum, metal based
- Layer numbers: 1-16
- Finished board thickness: 0.2-3.5mm, (8-138 mil)
- Board thickness tolerance: ±10%
- Cooper thicknesses: 0.5-4oz (18-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
- Minimum trace width (a): 0.075mm (3 mil)
- Minimum space width (b): 0.075mm (3 mil)
- SMD pitch (a): 0.2mm(8 mil)
- BGA pitch (b): 0.2mm (8 mil)
- Minimum solder mask dam (a): 0.0635mm (2.5mil)
- Soldermask clearance (b): 0.075mm (3 mil)
- Minimum SMT pad spacing (c): 0.075mm (3 mil)
- Solder mask thickness: 0.0007"(0.018mm)
- Minimum hole size (CNC): 0.2mm (8mil)
- Min punch hole size: 0.9mm (35 mil)
- Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm
- Hole position tol: ±0.075mm
- HASL/lead free HASL: 2.5um
- Immersion gold nickel: 3-7um, Au: 1-5u''
- OSP: 0.2-0.5um
- Certificates: RoHS, ISO9001:2008, SGS and UL
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