Shenzhen Ams Electronic Technology Co. Ltd
Shenzhen Ams Electronic Technology Co. Ltd
22-layer PCB with blind and buried holes (tier 3)
  • 22-layer PCB with blind and buried holes (tier 3)
22-layer PCB with blind and buried holes (tier 3)

22-layer PCB with blind and buried holes (tier 3)

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Characters:
    • HASL
    • Base material: FR-4
    • Board thickness: 0.2-3.2mm
    • Certifications: UL and TS16
    • RoHS Directive-compliant
    • Minimum finished hole size: 0.25mm
    • Outline: routing, punching, cut, V-cut and chamfered
    • Surface finish: enig/immersion gold
    • Copper thickness: 0.5, 1, 2 and 3oz
  • HASL
  • Base material: FR-4
  • Board thickness: 0.2-3.2mm
  • Certifications: UL and TS16
  • RoHS Directive-compliant
  • Minimum finished hole size: 0.25mm
  • Outline: routing, punching, cut, V-cut and chamfered
  • Surface finish: enig/immersion gold
  • Copper thickness: 0.5, 1, 2 and 3oz
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