Strive Technology Limited
Strive Technology Limited
1-layer PCB, Commitment of Quality Assurance, competitive price, HASL
  • 1-layer PCB, Commitment of Quality Assurance, competitive price, HASL
1-layer PCB, Commitment of Quality Assurance, competitive price, HASL

1-layer PCB, Commitment of Quality Assurance, competitive price, HASL

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T/T in Advance
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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick Details
    • Place of Origin: Guangdong China (Mainland)
    • Brand Name: STL
    • Model Number: STL-F-BG-0423C
    • Base Material: FR4
    • Copper Thickness: 0.5 oz - 5.0oz
    • Board Thickness: 0.25-6.0mm
    • Min. Hole Size: 0.1mm
    • Min. Line Width: 0.1mm
    • Min. Line Spacing: 0.1mm
    • Surface Finishing:Lead Free HASL, ENIG, Immersion Tin, Immersion Silver,gold plating,OSP
    • Solder mask: red,green,blue
  • Packaging & Delivery
    • Packaging Detail: customer's requirement
    • Delivery Detail: 6-10 days
  • PCB capabilities
    • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, rogers and high Tg
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1/0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Min legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of Origin: Guangdong China (Mainland)
  • Brand Name: STL
  • Model Number: STL-F-BG-0423C
  • Base Material: FR4
  • Copper Thickness: 0.5 oz - 5.0oz
  • Board Thickness: 0.25-6.0mm
  • Min. Hole Size: 0.1mm
  • Min. Line Width: 0.1mm
  • Min. Line Spacing: 0.1mm
  • Surface Finishing:Lead Free HASL, ENIG, Immersion Tin, Immersion Silver,gold plating,OSP
  • Solder mask: red,green,blue
  • Packaging Detail: customer's requirement
  • Delivery Detail: 6-10 days
  • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, rogers and high Tg
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1/0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Min legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
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