Strive Technology Limited
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Strive Technology Limited
Rigid PCB Assembly, 1.0oz Copper Thickness
  • Rigid PCB Assembly, 1.0oz Copper Thickness
  • Rigid PCB Assembly, 1.0oz Copper Thickness
  • Rigid PCB Assembly, 1.0oz Copper Thickness
Rigid PCB Assembly, 1.0oz Copper Thickness
Rigid PCB Assembly, 1.0oz Copper Thickness
Rigid PCB Assembly, 1.0oz Copper Thickness

Rigid PCB Assembly, 1.0oz Copper Thickness

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T/T in Advance
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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong and China (Mainland)
    • Copper thickness: 1.0oz
    • Board thickness: 1.60mm
    • Minimum hole size: 0.2mm
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.1mm
    • Surface finish: lead-free HASL
    • Colour of silkscreen: white
    • Colour of solder mask: green
  •  Packing and delivery:
    • Packing: as customer's request
    • Delivery: 6-10 days
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finish: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole:
      • PAD 0.1mm ( 0.4mm)
    • Surface finish: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold and gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong and China (Mainland)
  • Copper thickness: 1.0oz
  • Board thickness: 1.60mm
  • Minimum hole size: 0.2mm
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.1mm
  • Surface finish: lead-free HASL
  • Colour of silkscreen: white
  • Colour of solder mask: green
  • Packing: as customer's request
  • Delivery: 6-10 days
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finish: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole:
    • PAD 0.1mm ( 0.4mm)
  • Surface finish: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold and gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
  • PAD 0.1mm ( 0.4mm)

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