Strive Technology Limited
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Strive Technology Limited
PCB assembly prototype, with 1.6mm board thickness
  • PCB assembly prototype, with 1.6mm board thickness
PCB assembly prototype, with 1.6mm board thickness

PCB assembly prototype, with 1.6mm board thickness

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick Details
    • Place of Origin: Guangdong China (Mainland)
    • Brand name: STL
    • Model number: F-BG-0415n
    • Base material: FR4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Min. hole size: 0.2mm
    • Min. line width: 8mil
    • Min. line spacing: 8mil
    • Surface finishing: Lead Free HASL
    • Copper feature to Holes registration: +/-0.003"
    • Min plated drills to copper: 0.25mm, 0.30mm
    • Ring annulus: Min 0.1mm
    • Layer: 1 to 12 layers
    • Min. trace width space: 3mil
    • Max. PCB size: 540 x 520mm
    • Min. PCB thickness: 0.35mm
    • BGA ball diameter: 0.4mm ~ 1mm
  • Packaging & Delivery
    •  Packaging Detail: do as customer requested.
    • Delivery Detail: 15-20 days
  • Place of Origin: Guangdong China (Mainland)
  • Brand name: STL
  • Model number: F-BG-0415n
  • Base material: FR4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Min. hole size: 0.2mm
  • Min. line width: 8mil
  • Min. line spacing: 8mil
  • Surface finishing: Lead Free HASL
  • Copper feature to Holes registration: +/-0.003"
  • Min plated drills to copper: 0.25mm, 0.30mm
  • Ring annulus: Min 0.1mm
  • Layer: 1 to 12 layers
  • Min. trace width space: 3mil
  • Max. PCB size: 540 x 520mm
  • Min. PCB thickness: 0.35mm
  • BGA ball diameter: 0.4mm ~ 1mm
  •  Packaging Detail: do as customer requested.
  • Delivery Detail: 15-20 days
  • PCB Capabilities
    •  Materials: FR-4, CEM-3,CM-1,FR-1,Teflon, Aluminum, Rogers, High Tg
    • Layer: 1-12 layers
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0 mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10mm/0.10mm
    • Minimum hole/PAD 0.1mm/PAD: 0.4mm
    • Surface finished: Lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (min±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Min legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  •  Materials: FR-4, CEM-3,CM-1,FR-1,Teflon, Aluminum, Rogers, High Tg
  • Layer: 1-12 layers
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0 mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10mm/0.10mm
  • Minimum hole/PAD 0.1mm/PAD: 0.4mm
  • Surface finished: Lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (min±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Min legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm

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