Strive Technology Limited
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Products
Strive Technology Limited
PCB Assembly with High Quality and Lower Price, OEM and ODM, SMD DIP Components Assembly, FCT Test
  • PCB Assembly with High Quality and Lower Price, OEM and ODM, SMD DIP Components Assembly, FCT Test
PCB Assembly with High Quality and Lower Price, OEM and ODM, SMD DIP Components Assembly, FCT Test

PCB Assembly with High Quality and Lower Price, OEM and ODM, SMD DIP Components Assembly, FCT Test

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong, China (Mainland)
    • Brand name: STL
    • Model number: F-BG-0430X1
    • Base material: FR-4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.1mm
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.1mm
    • Surface finishing: HASL
    • Solder mask color: green 
  • Packaging and delivery details:
    • Packaging: according to customer's requirement           
    • Delivery lead-time: 15-20 days
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10mm/0.10mm
    • Minimum hole/PAD: 0.1mm/PAD 0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (min±7Ω)
    • Outline tolerance: CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong, China (Mainland)
  • Brand name: STL
  • Model number: F-BG-0430X1
  • Base material: FR-4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.1mm
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.1mm
  • Surface finishing: HASL
  • Solder mask color: green 
  • Packaging: according to customer's requirement           
  • Delivery lead-time: 15-20 days
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10mm/0.10mm
  • Minimum hole/PAD: 0.1mm/PAD 0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (min±7Ω)
  • Outline tolerance: CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm

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