Strive Technology Limited
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Products
Strive Technology Limited
PCBA OEM/ODM/EMS Services, SMT and SMD, Components Purchase, Prototype
  • PCBA OEM/ODM/EMS Services, SMT and SMD, Components Purchase, Prototype
PCBA OEM/ODM/EMS Services, SMT and SMD, Components Purchase, Prototype

PCBA OEM/ODM/EMS Services, SMT and SMD, Components Purchase, Prototype

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong, China (Mainland)
    • Layers: 2
    • Base material: FR-4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Minimum hole size: 2.0mm
    • Minimum line width: 0.2mm
    • Minimum line spacing: 0.2mm
    • Surface finishing: HASL lead-free
    • Solder mask color: green
  • Packing and delivery details:
    • Packing: according to customer's requests
    • Delivery lead-time: 15 to 20 days
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, rogers and high TG
    • Layers: 1 to 12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25 to 5.0mm
    • Copper thickness: 0.5 to 5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1/PAD 0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plated, selective immersion gold and gold plated
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance: CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong, China (Mainland)
  • Layers: 2
  • Base material: FR-4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Minimum hole size: 2.0mm
  • Minimum line width: 0.2mm
  • Minimum line spacing: 0.2mm
  • Surface finishing: HASL lead-free
  • Solder mask color: green
  • Packing: according to customer's requests
  • Delivery lead-time: 15 to 20 days
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, rogers and high TG
  • Layers: 1 to 12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25 to 5.0mm
  • Copper thickness: 0.5 to 5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1/PAD 0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plated, selective immersion gold and gold plated
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance: CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm

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