Strive Technology Limited
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Products
Strive Technology Limited
China PCB assembly, accept OEM and ODM, SMD DIP components assembly, FCT test
  • China PCB assembly, accept OEM and ODM, SMD DIP components assembly, FCT test
China PCB assembly, accept OEM and ODM, SMD DIP components assembly, FCT test

China PCB assembly, accept OEM and ODM, SMD DIP components assembly, FCT test

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Base material: FR-4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.2mm
    • Minimum line width: 0.12mm
    • Minimum line spacing: 0.15mm
    • Surface finishing: HASL
    • Solder mask color: green
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1mm/PAD 0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance:
      • CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong, China (Mainland)
  • Packing: customized
  • Delivery lead-time: 15-20 days
  • Base material: FR-4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.2mm
  • Minimum line width: 0.12mm
  • Minimum line spacing: 0.15mm
  • Surface finishing: HASL
  • Solder mask color: green
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1mm/PAD 0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance:
    • CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
  • CNC routing: ±0.1mm

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