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Basic Info

Payment Type:	T/T in Advance

Product Description

Quick details:

Place of origin: Guangdong China (mainland)
Brand name: STL-BG-02
Base material: FR4. copper
Thickness: 1oz
Board thickness: 1.6mm
Hole size: 0.2mm
Minimum line width: 3mm
Minimum line spacing: 3mm
Surface finishing: HASL
PCB: customized
PCB tolerance of finished thickness: ±5%
Hole tolerance:
- PTH: ±0.075
- NTPH: ±0.05
Solder mask: green
Max board size: 550mm*550mm
Layer count: 1-12

Quote requirement:

Gerber file and BOM list
Clear pics of PCBA or PCBA sample for us
Test method for PCBA

Our PCB manufacture and PCB assembly capabilities:

Layer 1-12 layers
Base materials: FR-4, CEM-3, aluminum, Rogers, high Tg
Thickness finished 0.25-5.0 mm
Copper thickness:
- Outer layer: 0.5oz-5oz
- Inner layer: 0.5oz-4oz
Min. line width/spacing: 0.10mm/0.10mm
Max. panel size: 550mm × 550mm
PCB min holes: 0.2mm
IC pitch (min): 0.2mm
Chip size (min): 0402/1005 (1.0x0.5mm)
BGA size: 8x6mm-55x55mm
BGA pin count: 48-600 pins
Packaging: SOP, SSOP, PLCC, QFP, QFN, BGA, FBGA and u-BGA
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
Current loading SMT: 3.5 million one day
Current DIP: 500,000 points one day

Place of origin: Guangdong China (mainland)

Brand name: STL-BG-02

Base material: FR4. copper

Thickness: 1oz

Board thickness: 1.6mm

Hole size: 0.2mm

Minimum line width: 3mm

Minimum line spacing: 3mm

Surface finishing: HASL

PCB: customized

PCB tolerance of finished thickness: ±5%

Hole tolerance:

PTH: ±0.075
NTPH: ±0.05

Solder mask: green

Max board size: 550mm*550mm

Layer count: 1-12

PTH: ±0.075

NTPH: ±0.05

Gerber file and BOM list

Clear pics of PCBA or PCBA sample for us

Test method for PCBA

Layer 1-12 layers

Base materials: FR-4, CEM-3, aluminum, Rogers, high Tg

Thickness finished 0.25-5.0 mm

Copper thickness:

Outer layer: 0.5oz-5oz
Inner layer: 0.5oz-4oz

Min. line width/spacing: 0.10mm/0.10mm

Max. panel size: 550mm × 550mm

PCB min holes: 0.2mm

IC pitch (min): 0.2mm

Chip size (min): 0402/1005 (1.0x0.5mm)

BGA size: 8x6mm-55x55mm

BGA pin count: 48-600 pins

Packaging: SOP, SSOP, PLCC, QFP, QFN, BGA, FBGA and u-BGA

BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)

Current loading SMT: 3.5 million one day

Current DIP: 500,000 points one day

Outer layer: 0.5oz-5oz

Inner layer: 0.5oz-4oz

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