Strive Technology Limited
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Products
Strive Technology Limited
Copper PCB board, no MOQ, small quantity are accepted, OEM/ODM orders are welcome, HASL
  • Copper PCB board, no MOQ, small quantity are accepted, OEM/ODM orders are welcome, HASL
Copper PCB board, no MOQ, small quantity are accepted, OEM/ODM orders are welcome, HASL

Copper PCB board, no MOQ, small quantity are accepted, OEM/ODM orders are welcome, HASL

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong, China (Mainland)
    • Base material: FR4
    • Copper thickness: 0.5-5.0oz
    • Board thickness: 0.25-6.0mm
    • Min hole size: 0.1mm
    • Min line width: 0.1mm
    • Min line spacing: 0.1mm
    • Surface finishing: lead-free HASL, ENIG, immersion tin, immersion silver, gold plating, OSP
    • Solder mask: red, green, blue
  • Packaging and delivery:
    • Packaging detail: as per customer's requirement
    • Delivery details: 6-10 days
  • PCB capabilities:
    • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1/0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Min legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong, China (Mainland)
  • Base material: FR4
  • Copper thickness: 0.5-5.0oz
  • Board thickness: 0.25-6.0mm
  • Min hole size: 0.1mm
  • Min line width: 0.1mm
  • Min line spacing: 0.1mm
  • Surface finishing: lead-free HASL, ENIG, immersion tin, immersion silver, gold plating, OSP
  • Solder mask: red, green, blue
  • Packaging detail: as per customer's requirement
  • Delivery details: 6-10 days
  • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1/0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Min legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm

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