Strive Technology Limited
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Products
Strive Technology Limited
Fast thick copper plate PCB manufacturer, no MOQ, small quantity are accepted
  • Fast thick copper plate PCB manufacturer, no MOQ, small quantity are accepted
Fast thick copper plate PCB manufacturer, no MOQ, small quantity are accepted

Fast thick copper plate PCB manufacturer, no MOQ, small quantity are accepted

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T/T in Advance
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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Base material: FR4
    • Copper thicknesses: 0.5-5.0oz
    • Board thicknesses: 0.25-6.0mm
    • Min hole size: 0.1mm
    • Min line width: 0.1mm
    • Min line spacing: 0.1mm
    • Surface finishing: lead-free HASL, ENIG, immersion tin, immersion silver, gold plating, OSP
    • Solder mask: red, green, blue
  • Packaging and delivery:
    • Packaging detail: as per customer's requirement
    • Delivery details: 6-10 days
  • PCB capabilities:
    • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1/0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Min legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Base material: FR4
  • Copper thicknesses: 0.5-5.0oz
  • Board thicknesses: 0.25-6.0mm
  • Min hole size: 0.1mm
  • Min line width: 0.1mm
  • Min line spacing: 0.1mm
  • Surface finishing: lead-free HASL, ENIG, immersion tin, immersion silver, gold plating, OSP
  • Solder mask: red, green, blue
  • Packaging detail: as per customer's requirement
  • Delivery details: 6-10 days
  • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1/0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Min legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm

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