Strive Technology Limited
Strive Technology Limited
PCBA for electronics good quality supplier, supply PCB SMT and DIP assembly
  • PCBA for electronics good quality supplier, supply PCB SMT and DIP assembly
PCBA for electronics good quality supplier, supply PCB SMT and DIP assembly

PCBA for electronics good quality supplier, supply PCB SMT and DIP assembly

Payment Type:
T/T in Advance
Quantity:

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Base material: FR-4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.1mm
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.1mm
    • Surface finishing: HASL
    • Solder mask color: green 
  • Packing and delivery:
    • Packing: according to customer's requirements           
    • Delivery lead-time: 15-20 days
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished range: 0.25-5.0mm
    • Copper thicknesses: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1mm/PAD 0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (min±7Ω)
    • Outline tolerance: CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Base material: FR-4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.1mm
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.1mm
  • Surface finishing: HASL
  • Solder mask color: green 
  • Packing: according to customer's requirements           
  • Delivery lead-time: 15-20 days
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished range: 0.25-5.0mm
  • Copper thicknesses: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1mm/PAD 0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (min±7Ω)
  • Outline tolerance: CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
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