8-layer HDI Printed Circuit Board for Industry Control
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Product Description
Product Description
- Multilayer rigid PCB's up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled impedance
- HDI (high-density interconnect)
- Blind and buried via holes
- FR4 standard epoxy and high temperature versions
- Polyimide, polyester and PET
- PTFE (polytetraflourethylene) and duriod (glass reinforced PTFE composite)
- Base material: aluminium
- Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
- CNC routing
- Scoring (V-grooving)
- Gold on nickel contact fingers
- LPSM (liquid photo image able solder mask) range of colours available
- Peelable solder mask
- Screened conductive inks (carbon)
- Bare board electrical testing
- Immersion silver
- Immersion gold
- Lead-free or HASL (hot air solder leveling)
- OSP (organic surface preservative)
- Gold finger
- Plating gold
- Immersion tin
- PCB design
- Circuit layout and drafting
- PCB copy
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