Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
Power tool multilayer PCB with immersion gold and green solder mask
  • Power tool multilayer PCB with immersion gold and green solder mask
Power tool multilayer PCB with immersion gold and green solder mask

Power tool multilayer PCB with immersion gold and green solder mask

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T/T or Western Union
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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • power tool multilayer pcb with immersion gold
  • Material: FR4
  • Thickness: 1.6mm
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high-density interconnect)
    • Blind and buried via holes
    • Certification: UL
    • Compliant with the RoHS directive
  • Substrates:
    • FR4 standard epoxy and high temperature versions
    • Polyimide, polyester and PET
    • PTFE (polytetra fluorethylene) and Duroid (glass reinforced PTFE composite)
    • Base material: aluminum
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Optional board:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Golden finger
  • Plating gold: immersion tin
  • We also offers:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high-density interconnect)
  • Blind and buried via holes
  • Certification: UL
  • Compliant with the RoHS directive
  • FR4 standard epoxy and high temperature versions
  • Polyimide, polyester and PET
  • PTFE (polytetra fluorethylene) and Duroid (glass reinforced PTFE composite)
  • Base material: aluminum
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Golden finger
  • PCB design
  • Circuit layout and drafting
  • PCB copy
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