Jasecen International (HK) Co. Ltd
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Products
Jasecen International (HK) Co. Ltd
Multilayer BGA board with immersion gold PCB
  • Multilayer BGA board with immersion gold PCB
Multilayer BGA board with immersion gold PCB

Multilayer BGA board with immersion gold PCB

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Multilayer
  • Surface finishes: lead-free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, gold finger plating, carbon ink printing, and peelable blue mask
  • 0.15mm line space width
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (High-density Interconnect)
    • Blind and buried via holes
    • Certification: UL
    • Compliant  with RoHS Directive
  • Substrates:
    • FR4 standard epoxy and high temperature versions
    • Polyimide, polyester and PET
    • PTFE (Polytetra Fluorethylene) and droid (glass reinforced PTFE composite)
    • Base material: aluminum
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • Optional board:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Golden finger
  • Plating: gold immersion tin
  • We offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
    • PCB assembly
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (High-density Interconnect)
  • Blind and buried via holes
  • Certification: UL
  • Compliant  with RoHS Directive
  • FR4 standard epoxy and high temperature versions
  • Polyimide, polyester and PET
  • PTFE (Polytetra Fluorethylene) and droid (glass reinforced PTFE composite)
  • Base material: aluminum
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Golden finger
  • PCB design
  • Circuit layout and drafting
  • PCB copy
  • PCB assembly

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