Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
Multilayer PCB with immersion gold up to 30U and red solder mask
  • Multilayer PCB with immersion gold up to 30U and red solder mask
Multilayer PCB with immersion gold up to 30U and red solder mask

Multilayer PCB with immersion gold up to 30U and red solder mask

Payment Type:
T/T or Western Union
Quantity:

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • With immersion gold up to 30U and red solder mask
  • Material: FR-4
  • Thickness: 1.6mm
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high-density interconnect)
    • Blind and buried via holes
    • Certification: UL
    • RoHS Directive-compliant
  • Substrates:
    • FR-4 standard epoxy and high temperature versions
    • Polyimide, polyester and PET
    • PTFE (polytetra fluorethylene) and droid (glass reinforced PTFE composite)
    • Base material: aluminum
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • Optional board:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
  • Plating: gold immersion tin
  • We offers:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high-density interconnect)
  • Blind and buried via holes
  • Certification: UL
  • RoHS Directive-compliant
  • FR-4 standard epoxy and high temperature versions
  • Polyimide, polyester and PET
  • PTFE (polytetra fluorethylene) and droid (glass reinforced PTFE composite)
  • Base material: aluminum
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • PCB design
  • Circuit layout and drafting
  • PCB copy
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