Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
Double-sided PCB with OSP, immersion gold, HASL orders are welcome
  • Double-sided PCB with OSP, immersion gold, HASL orders are welcome
Double-sided PCB with OSP, immersion gold, HASL orders are welcome

Double-sided PCB with OSP, immersion gold, HASL orders are welcome

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Basic Info
Basic Info
Payment Type: T/T, Western Union
Product Description
Product Description
  • Blue solder mask
  • Rigid: PCB
  • Material: FR-4
  • Board types:
    •  Multiple layer rigid PCB's up to 18 layers
    •  Flexible and flex-rigid circuits up to 18 layers
    •  Controlled Impedance
    •  HDI (high density interconnect)
    •  Blind and buried via holes
    •  RoHS and UL compliant on request
  • Substrates:
    •  FR4 standard epoxy and high temp versions
    •  Polyimide, polyester and PET
    •  PTFE (polytetrafluorethylene) and duroid (glass reinforced PTFE composite)
    •  Aluminum based materials
    •  Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    •  CNC routing
    •  Scoring (V-Grooving)
    •  Gold on nickel contact fingers
    •  LPSM (liquid photoimage able solder mask) range of colors available
    •  Peel able solder mask
    •  Screened conductive Inks (carbon)
    •  Bare board electrical testing
  • Board finishes:
    •  Immersion silver
    •  Immersion gold
    •  Lead free or HASL (hot air solder leveling)
    •  OSP (organic surface preservative)
    •  Gold finger
    •  Plating gold
    •  Immersion tin
  • We also offer:
    •  PCB design
    •  Circuit layout and drafting
    •  PCB copy
  •  Multiple layer rigid PCB's up to 18 layers
  •  Flexible and flex-rigid circuits up to 18 layers
  •  Controlled Impedance
  •  HDI (high density interconnect)
  •  Blind and buried via holes
  •  RoHS and UL compliant on request
  •  FR4 standard epoxy and high temp versions
  •  Polyimide, polyester and PET
  •  PTFE (polytetrafluorethylene) and duroid (glass reinforced PTFE composite)
  •  Aluminum based materials
  •  Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  •  CNC routing
  •  Scoring (V-Grooving)
  •  Gold on nickel contact fingers
  •  LPSM (liquid photoimage able solder mask) range of colors available
  •  Peel able solder mask
  •  Screened conductive Inks (carbon)
  •  Bare board electrical testing
  •  Immersion silver
  •  Immersion gold
  •  Lead free or HASL (hot air solder leveling)
  •  OSP (organic surface preservative)
  •  Gold finger
  •  Plating gold
  •  Immersion tin
  •  PCB design
  •  Circuit layout and drafting
  •  PCB copy

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