Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
Multilayer high frequency PCB for high end electronics
  • Multilayer high frequency PCB for high end electronics
Multilayer high frequency PCB for high end electronics

Multilayer high frequency PCB for high end electronics

Get Latest Price
Payment Type:
T/T, Western Union
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, Western Union
Product Description
Product Description
  • High-frequency PCB for high-end electronic products
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 2.0
  • Hole diameter: ≥0.2mm
  • Black solder mask
  • Surface technology: lead-free HASL, immersion gold
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
    • RoHS and UL-compliant on requirements
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyamide, polyester and PET
      PTFE (poly-tetra fluorethylene) and Duroid (glass reinforced PTFE composite)
    • Aluminum-based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo image-able solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • RoHS and UL-compliant on requirements
  • FR4 standard epoxy and high temp versions
  • Polyamide, polyester and PET
    PTFE (poly-tetra fluorethylene) and Duroid (glass reinforced PTFE composite)
  • Aluminum-based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo image-able solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin

    • Send your message to this supplier

    • Ms.  Joy

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories