Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
High-frequency multilayer PCBNew
  • High-frequency multilayer PCBNew
High-frequency multilayer PCBNew

High-frequency multilayer PCBNew

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • High-tech and high frequency
  • 30U immersion gold
  • OEM for Huawei
  • High-density multilayer PCB,
  • Color: green solder mask
  • Immersion gold
  • Impedance: 100±100 Ohms
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (High Density Interconnect)
    • Blind and Buried via holes
    • RoHS and UL compliant on request
  • Substrates:
    •  FR4 Standard epoxy and high temp versions
    •  Polyimide, Polyester and PET
    •  PTFE (polytetra flourethylene) and Duriod (glass reinforced PTFE composite) aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board Options:
    • CNC routing
    • Scoring (V-Grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive Inks (carbon)
    • Bare board electrical testing
  • Board Finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (Organic Surface Preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (High Density Interconnect)
  • Blind and Buried via holes
  • RoHS and UL compliant on request
  •  FR4 Standard epoxy and high temp versions
  •  Polyimide, Polyester and PET
  •  PTFE (polytetra flourethylene) and Duriod (glass reinforced PTFE composite) aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-Grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive Inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (Organic Surface Preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy
  • Send your message to this supplier

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