Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
High frequency microwave PCBs with high technology
  • High frequency microwave PCBs with high technology
High frequency microwave PCBs with high technology

High frequency microwave PCBs with high technology

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T/T or Western Union
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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Colors: green solder mask
  • Hole: 0.25mm
  • Board types:
    •  Multilayer rigid PCB's up to 18 layers
    •  Flexible and flex-rigid circuits up to 18 layers
    •  Controlled impedance
    •  HDI (high density interconnect)
    •  Blind and buried via holes
    •  RoHS and UL compliant on request
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    •  CNC routing
    •  Scoring (V-grooving)
    •  Gold on nickel contact fingers
    •  LPSM (liquid photoimageable solder mask) range of colours available
    •  Peelable solder mask
    •  Screened conductive inks (carbon)
    •  Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  •  Multilayer rigid PCB's up to 18 layers
  •  Flexible and flex-rigid circuits up to 18 layers
  •  Controlled impedance
  •  HDI (high density interconnect)
  •  Blind and buried via holes
  •  RoHS and UL compliant on request
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  •  CNC routing
  •  Scoring (V-grooving)
  •  Gold on nickel contact fingers
  •  LPSM (liquid photoimageable solder mask) range of colours available
  •  Peelable solder mask
  •  Screened conductive inks (carbon)
  •  Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy
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