Mobile phone HDI PCB with 8 layers for communication
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Product Description
Product Description
- Multilayer rigid PCBs up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled impedance
- HDI (high density interconnect)
- Blind and buried via holes
- RoHS Directive-compliant
- Standard: UL
- FR-4 standard epoxy and high temp versions
- Polyimide, polyester and PET
- PTFE (polytetrafluorethylene) and duroid (glass reinforced PTFE composite)
- Aluminum based materials
- Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion/higher TG levels
- CNC routing
- Scoring (V-grooving)
- Gold on nickel contact fingers
- LPSM (liquid photo image able solder mask)
- Range of colours available
- Peel able solder mask
- Screened conductive inks (carbon)
- Bare board electrical testing
- Immersion silver
- Immersion gold
- Lead-free or HASL (hot air solder levelling)
- OSP (organic surface preservative)
- Gold finger
- Gold plating
- Immersion tin
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