Jasecen International (HK) Co. Ltd
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Products
Jasecen International (HK) Co. Ltd
High density printed circuit board with high quality and high technology
  • High density printed circuit board with high quality and high technology
High density printed circuit board with high quality and high technology

High density printed circuit board with high quality and high technology

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • High density printed circuit board with high quality and high technology
  • Suitable for high-end electronic products
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 1.6mm
  • Hole diameter: ≥0.2mm
  • Black solder mask
  • Surface technology: lead-free HASL and immersion gold
  • Board types:
    • Multilayer rigid PCB's: up to 18 layers
    • Flexible and flex-rigid circuits: up to 18 layers
    • Controlled impedance
    • HDI (high-density interconnection)
    • Blind and buried via holes
    • RoHS directive-compliant
    • Standard: UL
  • Substrates:
    • FR4 standard epoxy and high temperature versions
    • Polyimide, polyester and PET
    • PTFE (polytetra fluorethylene), Duroid (glass-reinforced PTFE composite) and aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficient of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Gold plating
    • Immersion tin
  • Multilayer rigid PCB's: up to 18 layers
  • Flexible and flex-rigid circuits: up to 18 layers
  • Controlled impedance
  • HDI (high-density interconnection)
  • Blind and buried via holes
  • RoHS directive-compliant
  • Standard: UL
  • FR4 standard epoxy and high temperature versions
  • Polyimide, polyester and PET
  • PTFE (polytetra fluorethylene), Duroid (glass-reinforced PTFE composite) and aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficient of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Gold plating
  • Immersion tin

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